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Bonding Tools for Copper Wire Bonding
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Published : Jun 21, 2011
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Contributor : Marcom
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Marketing and Technical presentation for Bonding Tools on K&S Copper Technology Seminar
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Cutting Edge in Copper Wire Bonding (Simplified Chinese)
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Published : Jun 21, 2011
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Contributor : Marcom
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Simplified Chinese Version -- Copper Wire Bonder technical presentation on K&S Copper Technology Seminar
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Market Trend of Copper Wire Bonding (Simplified Chinese)
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Published : Jun 21, 2011
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Contributor : Marcom
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Simplified Chinese Version --- Copper Wire Bonding Marketing Presentation on K&S Copper Technology Seminar
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Download
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Cutting Edge in Copper Wire Bonding
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Published : Jun 21, 2011
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Contributor : Marcom
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Copper Wire Ball Bonding Technical presentation on K&S Copper Technology seminar
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Market Trend of Copper Wire Bonding
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Published : Jun 21, 2011
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Contributor : Marcom
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Copper Wire Bonding Market presentation on K&S Copper Technology Seminar
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Download
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INNOVATIVE BONDING TOOL DESIGN FOR FINE PITCH COPPER WIRE APPLICATIONS
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Published : Jun 21, 2011
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Contributor : Giyora Gur 1, a, Langut Ilan 1,b
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K&S Bonding Tools has developed an innovative CuPRAplus capillary solution that contains special design features (patent pending) that address 2nd bond issue in copper wire bonding. The capillary solution enables better copper wire bonding process performance in terms of stitch pull and tail pull variability, resulting in a more robust process. In this article, tests results of 0.8 and 1.0 [mil] Cu wire applications are presented.
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